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When we talk about the cost of AI infrastructure, the focus is usually on Nvidia and GPUs -- but memory is an increasingly ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

New York residents who qualify can now apply for the Home Energy Assistance Program. The program is designed for New York residents who are at risk of running out of fuel or having their utility ...

For years, software stacks kept getting more complex. OpenAI is moving in the opposite direction. This video breaks down how AI is collapsing layers that used to be mandatory. The impact affects ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

Memory chips are a key component of artificial intelligence data centers. The boom in AI data center construction has caused a shortage of semiconductors, which are also crucial for electronics like ...

Cisa has added six CVEs to its Kev catalogue this week, including newly-disclosed issues in Google Chromium and Dell ...

SK Hynix's revenue jumped 66% in the December quarter compared with the same period a year earlier. Operating profit surged 137% over the same period. The company has benefited from a surge in demand ...

Jan 27 (Reuters) - U.S. memory chip maker Micron Technology (MU.O), opens new tab is set to announce new memory chip manufacturing capacity investment in Singapore, three people briefed on the matter ...