Abstract: Deep learning-based surface defect detection shows significant promise for precision manufacturing. However, practical deployments are limited by challenges such as complex defect patterns, ...
The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
Abstract: The exponential growth of modern industrial production systems, coupled with escalating quality requirements in manufacturing sectors, has stimulated substantial research interest in ...
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