The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
The report "Machine Vision Camera Market by Imaging Spectrum (Visible Light, Visible + IR/NIR), Frame Rate (<25 fps, 25-125 ...
Add Yahoo as a preferred source to see more of our stories on Google. Lane closures on a stretch of the M1 are still in place because of what engineers describe as a surface defect. A National ...
The European Space Agency (ESA) is accelerating a quiet revolution on the factory floor: using artificial intelligence to design, inspect, ...
1 Guangzhou Institute of Metrology and Testing Technology, Guangzhou, China 2 School of Artificial Intelligence and Automation, Huazhong University of Science and Technology, Wuhan, China Introduction ...
Even the smallest surface defect or slight roughness can significantly affect component performance. A micron-scale imperfection may appear insignificant at first; however, it can significantly alter ...
In the context of Industry 4.0, autonomous and data-driven manufacturing processes are advancing rapidly, with wire arc additive manufacturing (WAAM) emerging as a promising technique for producing ...
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