Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Abstract: The nonlinear dynamics introduced by boost converters and constant power loads (CPLs) pose significant challenges to microgrid (MG) controller design. To mitigate the detrimental effects of ...
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