Abstract: In UBM/RDL manufacturing, the process challenge to keep low contact resistance in high-density interconnects increases with the ongoing scaling towards miniaturization of the critical design ...
Abstract: Cracking of the silicon chip of a wafer level chip scale package (WLCSP) is encountered during a thermal cycle test (TCT). This paper attempts to examine the failure mechanism. Both ...
2 Sydney Eye Hospital and Save Sight Institute, University of Sydney, NSW, Australia Correspondence to: R Max Conway Sydney Eye Hospital and Save Sight Institute, University of Sydney, NSW, Australia; ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results