Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...
Abstract: 2.5 D package has been widely used in electronics packages which using multiple integrated circuit chips placed on an interposer to increase its capacity and performance tremendously than ...
Based on 2.5-Dimensional (2.5D) frequency selective surface (FSS) structures, a new miniaturized frequency selective surface structure is proposed in this work to operate as a bandreject filter in the ...
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